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GENERAL INFORMATION:
Course No. and Title: VEE 100 Soldering |
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Campus: Pohnpei |
Initiator: Nelchor T. Permitez |
Date: October 21, 2014 |
Course description: The course covers the proper soldering of lead and lead free electronic components using the industry standard tools and materials. Students will gain experience in electronic component insertion and extraction and Printed Circuit Board (PCB) rework. |
COURSE HOURS/CREDITS:
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Hours per Week |
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No. of Weeks |
|
Total Hours |
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Semester Credits |
Lecture |
|
|
x |
|
= |
/16 |
= |
|
Laboratory |
|
|
x |
|
= |
/48 |
= |
|
Lecture/Lab |
|
1.5 |
x |
16 |
= |
24/16 |
= |
1.5 |
Workshop |
|
|
x |
|
= |
/32 |
= |
|
|
|
|
|
|
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PURPOSE OF COURSE:
[ ] Degree requirement
[ ] Degree elective
[X] Certificate
[ ] Other
PREREQUISITES: VSP 121 or concurrently.
PSLOS OF OTHER PROGRAMS THIS COURSE MEETS:
PSLO# |
Program |
1. Practice safety and occupational health procedures in the workplace. |
Associate of Applied Science in Telecommunication |
1) INSTITUTIONAL STUDENT LEARNING OUTCOMES
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2) PROGRAM STUDENT LEARNING OUTCOMES (PSLOs): The student will be
able to:
1. Practice safety and occupational health procedures in the workplace.
2. Use electronics tools and test equipment competently.
3. Interpret schematic diagrams and waveforms.
4. Build electronics projects to a given specification.
5. Perform troubleshooting techniques to maintain and resolve hardware/software related problems in a personal computer system.
6. Perform troubleshooting techniques to maintain, diagnose, and repair electronic equipment and devices.
COURSE STUDENT LEARNING OUTCOMES (CSLOs) (General): The student will be able to:
COURSE STUDENT LEARNING OUTCOMES (CSLOs) (Specific): The student will be able to: | |||
CSLO (General) 1: Demonstrate knowledge in soldering tools and materials. |
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Student Learning Outcome (specific) |
ISLO |
PSLO |
Assessment Strategies |
|
7 |
2 |
A test with short answer questions is used to assess the CSLO 1.1 to 1.4.
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CSLO (General) 2: Solder electronics components onto Printed Circuit Board (PCB) assembly kit. |
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Student Learning Outcome (specific) |
ISLO |
PSLO |
Assessment Strategies |
2.1 Insert and extract wires, terminal |
7* |
2 |
A rubric is used to assess students’ competence in soldering and reworking of wires, terminals and electronics components on a PCB assembly (CSLO 2.1 to 2.3). |
2.2 Solder wires, terminal strips and |
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2.3 Rework cold solder joint, |
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CSLO (General) 3: Demonstrate skills in soldering of Solder Ball Grid Array (BGA) Integrated Circuits (IC) and lead free Surface Mount Device (SMD). |
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Student Learning Outcome (specific) |
ISLO |
PSLO |
Assessment Strategies |
3.1 Solder BGA IC using hot air solder station. |
7 |
2 |
A rubric is used to assess students’ competence in CSLO 3.1 to 3.4 in soldering and reworking of BGA IC using hot air and infra-red solder station. |
3.2 Reball BGA IC using BGA paste and solder ball. |
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3.3 Solder lead free SMD using infra- |
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3.4 Demonstrate BGA IC rework procedure. |
COURSE CONTENT
METHOD OF INSTRUCTION
[ X ] Lecture [ ] Cooperative learning groups
[ X ] Laboratory [ ] In-class exercises
[ X ] Audio visual [ X ] Demonstrations
[ ] Other
REQUIRED TEXT(S) AND COURSE MATERIALS:
REFERENCE MATERIALS:
Nida Corporation. (2002). Mini Courses: Wiring. Melborne, FL: Nida Corporation
Publishing (or most recent edition).
INSTRUCTIONAL COSTS:
None
EVALUATION:
Student must achieve 70% mastery or a "C" grade or higher to pass this course.
A hands-on activity using rubric and written test (mid-term and final examination) are used as summative assessment tool.
CREDIT BY EXAMINATION:
None
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